The SCS G3P8 Spin Coater accurately applies liquid coating materials on planar substrates. This spin coater stores and executes up to 30 programs with up to 20 steps each. Each step of the cycle can be defined in the range of 0-9999 RPM with ramp times from 0.1 to 25.5 seconds. Ramp-up time is dependent on the chuck size and the substrate weight. A single step may have a dwell time of up to 999 seconds. Coating cycles are interruptible by the operator at any time. This spin coater has chucks designed for 1- to 4-inch wafers or pieces.

The Mask aligner is used in photolithography processes to transfer a pattern from a mask to a photoresist coating on a substrate. The MA-6 aligner can handle wafers from 2-inch to 6-inch and is optimized for 365 nm and 405 nm wavelength from a mercury lamp. Usually, exposure resolution of 0.8 - 1 µm and alignment resolution better than 1µm are possible.

The Instructional Cleanroom provides two ovens for curing photoresist during photolithography processes. One oven is set to 95 °C for a soft bake step, and the other to 120 °C for hardbake and dehydration steps.

A precision electronic hot plate provides an accurate and uniform temperature across a surface. It is designed to cure photoresist. The hot plate has a 12 inch by 12-inch substrate.