The Technic Micro PD RIE in the Instructional Cleanroom generates oxygen plasma to clean or descum wafers. The chamber is only available for use of CMOS-qualified processes with approved process flows. The system is currently set up for IC fabrication and restricted to designated users under supervision of IEN’s staff.

The RIE-IC is a manually loaded Reactive Ion Etcher system. It is used to etch dielectric materials such as SiO₂ by using CF₄ and O₂ as etching gases. The chamber has an aluminum plate with grooves for six 2-inch wafers.