IMS Instructional Center
4) MEMS Fabrication

The Instructional Cleanroom has capability of fabricating MEMS devices on silicon wafers. Due to the varied nature of MEMS devices and processes, some steps of microfabrication may require extra processes outside of the Instructional Cleanroom. For example, there are limitations on material selection due to compatibility concerns with the CMOS fabrication in the cleanroom. Especially, potassium hydroxide solutions (KOH) are not allowed to be used in the Instructional Cleanroom. Instead, non-CMOS compatible steps are processed in the main Pettit cleanroom and the wafers are kept out of the Instructional Cleanroom afterward.


Current Process Flow for CMOS Fabrication (Spring 2020)

MEMS Process Flow
MEMS Process Flow


Current Mask Design for MEMS Devices of MEMS Fabrication Course (Fall 2020)

CMOS Mask Layout
MEMS Mask Layout

(Back to top)

Related Links
Contact Information
Seung-Joon Paik, Ph.D.
Instructional Center coordinator
Senior Research Engineer
seung.paik@ien.gatech.edu
404-894-8807