The Georgia tech IEN provides an instructional lab facility to support advanced training and lab courses taught in the area of CMOS fabrication, MEMS fabrication, and micro/nanoelectronic processing. The facility located in the Joseph M. Pettit building consists of an 1100 ft2 Instructional Cleanroom (class 100) and a 340 ft2 Device Characterization Lab for wafers and bare chips.
WHAT WE OFFER:
We provide a group of lab training sessions to students who are interested in microfabrication processes from a wide variety of departments such as Electrical Engineering, Mechanical Engineering, Chemical and Biomolecular Engineering, Biomedical Engineering, etc. The lab sessions are provided as a part of accredited College of Engineering lecture courses. Students of the CoE courses are divided into small groups and have unique hands-on experiences of microfabrication in a cleanroom environment under an instructor’s expert guidance. The hands-on processes include:
- Oxidation and Diffusion doping
- Photolithography
- Etching
- Metallization
- Wafer Probing
- Electrical Testing of wafers and bare chips
Our expert staff can carry out feasibility studies to determine whether our CMOS-compatible micromachining technologies and device testing equipment are advantageous over other technologies. Our feasibility studies are carried out as follows:
- User provides us with a detailed problem description, constraints and desired outcome using the Request Assistance form
- Feasible processes and plan are suggested. A meeting is scheduled if needed.
- User provides us with samples for processing and testing
- Samples are processed
- Results are evaluated and sent to user
- User provides us with feedback
- Development of device testing
Due to the versatile nature of device testing, users will work with a staff member in order to configurate the best setup and to determine parameters for the desired outcome. Most testing will be carried out with a probe station directly on wafers or bare dies. The challenges to the testing parameters are finding the appropriate configuration for each sample, including ground connection, voltage/current range, frequency range, impedance matching, etc.