The e-beam evaporator is used to coat samples with various metals. Unlike sputtered films, evaporators only coat surfaces on the substrate with a direct line of sight to the source material. Typical deposition rates range from 1 Å/sec to 3 Å/sec.

The filament evaporator is used to coat samples with various metals. The PVD is a good choice for samples that need to be evaporator coated (to avoid coating the sides of rough topologies) but are sensitive to x-ray radiation from the E-beam. A single substrate holder 12-inches in diameter can hold multiple substrates. Currently, it is dedicated to deposit an Al/Si alloy for CMOS processes.