Packaging

Wafer Bonding

Karl Suss SB8E - Anodic Bonding

Equipment
	Equipment	Karl Suss SB8E
	Manufacturer:	Karl Suss
	Model	SB8E Wafer Bonder
	Substrate Size	6" and 8" wafer

	Bonding Parametersa,b
	Step 1
	Top Temp (C)	50
	Bot Temp (C)	50
	Pressure/Vac (kPa)	100
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	30
	Action	Contact

	Step 2
	Top Temp (C)	50
	Bot Temp (C)	50
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	30
	Action	N/A

	Step 3
	Top Temp (C)	50
	Bot Temp (C)	50
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	30
	Action	Clamps

	Step 4
	Top Temp (C)	50
	Bot Temp (C)	50
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	30
	Action	Spacers

	Step 5
	Top Temp (C)	350
	Bot Temp (C)	350
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	150
	Action

	Step 6
	Top Temp (C)	350
	Bot Temp (C)	350
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	90
	Action	ToolDown

	Step 7
	Top Temp (C)	350
	Bot Temp (C)	350
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	150
	Voltage (V)	-750
	Alarm (min)	90
	Action	E1

	Step 8
	Top Temp (C)	350
	Bot Temp (C)	350
	Pressure/Vac (pKa)	5e-4
	Tool Pressure (pKa)	150
	Voltage (V)	0
	Alarm (min)	90
	Action

	Step 9
	Top Temp (C)	350
	Bot Temp (C)	350
	Pressre/Vac (pKa)	5e-4
	Tool Pressure (pKa)	150
	Voltage (V)	-1200
	Wait (min)	45
	Alarm (min)	105
	Action	E12

	Step 10
	Top Temp (C)	100
	Bot Temp (C)	100
	Pressure/Vac (pKa)	5e-4
	Tool Pressure (pKa)	0
	Voltage (V)	0
	Alarm (min)	90
	Action	N/A

	Step 11
	Top Temp (C)	100
	Bot Temp (C)	100
	Pressure/Vac (pKa)	5e-4
	Tool Pressure (pKa)	0
	Voltage (V)	0
	Alarm (min)	90
	Action	ToolUp

	Step 12
	Top Temp (C)	50
	Bot Temp (C)	50
	Pressure/Vac (pKa)	100
	Tool Pressure (pKa)	0
	Voltage (V)	0
	Alarm (min)	270
	Action	N/A

Karl Suss SB8E - Thermal Compression

	Equipment
	Equipment	Karl Suss SB8E
	Manufacturer:	Karl Suss
	Model	SB8E Wafer Bonder
	Substrate Size	6" and 8" wafer

	Bonding Parametersa,b
	Step 1
	Top Temp (C)	50
	Bot Temp (C)	50
	Pressure/Vac (kPa)	100
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	30
	Action	Contact

	Step 2
	Top Temp (C)	50
	Bot Temp (C)	50
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	30
	Action	N/A

	Step 3
	Top Temp (C)	50
	Bot Temp (C)	50
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	30
	Action	Clamps

	Step 4
	Top Temp (C)	50
	Bot Temp (C)	50
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	30
	Action	Spacers

	Step 5
	Top Temp (C)	350
	Bot Temp (C)	350
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	150
	Action

	Step 6
	Top Temp (C)	350
	Bot Temp (C)	350
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	0
	Voltage (V)	0
	Alarm (min)	90
	Action	ToolDown

	Step 7
	Top Temp (C)	350
	Bot Temp (C)	350
	Pressure/Vac (kPa)	5e-4
	Tool Pressure (kPa)	150
	Voltage (V)	-750
	Alarm (min)	90
	Action	E1

	Step 8
	Top Temp (C)	350
	Bot Temp (C)	350
	Pressure/Vac (pKa)	5e-4
	Tool Pressure (pKa)	150
	Voltage (V)	0
	Alarm (min)	90
	Action

	Step 9
	Top Temp (C)	350
	Bot Temp (C)	350
	Pressre/Vac (pKa)	5e-4
	Tool Pressure (pKa)	150
	Voltage (V)	-1200
	Wait (min)	45
	Alarm (min)	105
	Action	E12

	Step 10
	Top Temp (C)	100
	Bot Temp (C)	100
	Pressure/Vac (pKa)	5e-4
	Tool Pressure (pKa)	0
	Voltage (V)	0
	Alarm (min)	90
	Action	N/A

	Step 11
	Top Temp (C)	100
	Bot Temp (C)	100
	Pressure/Vac (pKa)	5e-4
	Tool Pressure (pKa)	0
	Voltage (V)	0
	Alarm (min)	90
	Action	ToolUp

	Step 12
	Top Temp (C)	50
	Bot Temp (C)	50
	Pressure/Vac (pKa)	100
	Tool Pressure (pKa)	0
	Voltage (V)	0
	Alarm (min)	270
	Action	N/A

Wire Bonding

K&S 4523A - Al Wedge Bonding

	Equipment
	Equipment	K&S 4523A Wedge Bonder
	Manufacturer:	Karl Suss
	Model	4523A SemiAuto
	Wire Material	Aluminum
	Wire Diameter	25 um

	Substrate
	Substrate Size	6" x 6" maximum
	Wire Length	10 mm maximum
	Pad Size	100 um minimum
	Pad Spacing	50 um minumum

	Bonding Parametersa,b
	Tail	8
	Loop	6
	Search 1	4
	Power 1	7
	Time 1	8
	Force 1	5
	Search 2	7
	Power 2	8
	Time 2	8
	Force 2	5
	Ball Size	6
	Temperature	up to 130 C

a: The parameters well worked in the past b: Optimized for bonding to ENIG plated FR4 200 um pads

K&S 4522 - Au Ball Bonding

	Equipment
	Equipment	K&S 4522 Ball Bonder
	Manufacturer:	Karl Suss
	Model	4522
	Wire Material	Gold
	Wire Diameter	25 u

	Substrate
	Substrate Size	6" x 6" maximum
	Wire Length	10 mm maximum
	Pad Size	100 um minimum
	Pad Spacing	50 um minumum

	Bonding Parametersa,b
	Tail	8
	Loop	6
	Search 1	4
	Power 1	7
	Time 1	8
	Force 1	5
	Search 2	7
	Power 2	8
	Time 2	8
	Force 2	5
	Ball Size	6
	Temperature	up to 130 C

a: The parameters well worked in the past b: Optimized for bonding to ENIG plated FR4 200 um pads

Flip Chip Bonding

FineTech - Sn/Pb Solder Bonding

	Equipment
	Equipment	Finetech Sub-micron Flip-Chip Bonder
	Manufacturer	FineTech
	Model

	Bonding Parametersa,b