Sputterers
Location: Pettit Cleanroom
Substrate Size: < 6 in
Number of Substrates Allowed: ?
Number of Crucibles: ?
Metals Available: Al, Cr, Cu, Ag, Fe, Ni,
Pd, Pt, Ru, Ag, Ta, Ti, W
Special Features:
Two 3" and two 8" sputter guns;
Location: Marcus Inorganic Cleanroom
Substrate Size: < 12 in
Number of Substrates Allowed: 1 - 3
Metals Available: Al, Cu, Ag, Fe, Ni, Pt
Sputter two or more dissimilar
materials simultaneously;
Substrate Size: < 4 in
Number of Substrates Allowed: 1 - 4
Depositions Available: Al2O3, SiO2,
In2O3, Al, Cr, Cu, Ta, Ti, W, Si, ZnO
The system is equipped with two 3" DC
target positions and two 3" RF targets;
Number of Substrates Allowed: 1
Metals Available: Al, Al/Si, Au, Ti, Cr,
Cu, Mo, Mo/Cu, Ni, Si, Ta
High quality;
ALD
Substrate Size: < 8 in
Number of Substrate Allowed: 1 – 3
Depositions Available: Al, ZnO, Pt, AlN, AlO3
Ultra high aspect ratios;
Film thickness can be controlled to
within 1nm
E-beam Evaporators
Location: Instructional Center
Metals Available: Ti, Cr, Au, Ni, Al, Cu,
Fe, Ag, Mo, W, Sn, Sr, Pd, CdSe
Substrate Size: 4 in or smaller
Number of Substrates Allowed: 3
Number of Crucibles: 6
Metals Available: Au, Pt, Ti, Cr, Cu,
Al, Fe, Ni, Pd, Ag, Sn
Substrates flip-over during deposition;
Auto beam alignment
Metals Available: Ti, Au, Cr, Ni, Al, Cu,
Fe, Ag, Sn, Pd
Provides very little coating to the sides of any features
Number of Substrate Allowed: 1 – 20
Metals Available: Ti, Cr, Au, Ni, Pt,
Al, Cu, Fe, Ag, W, Sn, Sr, Pd, Ge, V,
NiCr, Nb, Bi, In
Filament Evaporator
Substrate Size: ?
Depositions Available: Cr, Cu, Ti
Ability to deposit on both sides of wafer;
Substrate Size: < 4" wafer
Depositions Available: Al, Cr, Cu, Au, Fe, Ni, Pt, Ag, Sn, Ti
Use of boats/wires to melt materials
Plating Station
Materials Allowed: Cu, Ni, Fe, Solder,
Au (with permission)
