Spinners
Spinners Comparison
| Equipment Name | Location | Type | Substrate Size | Has Hotplate |
| BLE Spinner | Marcus | Manual | 4 in; 6 in | yes |
| SCS G3P8 | Marcus; Pettit | Manual | small piece, 4 in; 6 in | No |
| Karl Suss RC8 - Marcusb | Marcus | Auto | 4 in | Yes |
| Karl Suss RC8 - Pettitb | Pettit | Manual | 4 in; 6 in | No |
| Laurel Spinnera | Marcus | Manual | small piece only | No |
a: Laurel Spinner is dedicated for PZT and other ferroelectric spin-coating
b: No SU-8 is allowed
BLE Spinner
 | Location: Marcus Inorganic Cleanroom Substrate Size: 4" and 6" wafers Special Features: Computer controlled interface Speeds up to 5000 rpm Any type of photoresist can be used
|
Karl Suss RC8 Spinner - Marcus
 | Location: Marcus Inorganic Cleanroom Substrate Size: < 6 in Number of Substrates Allowed: one 4" wafer Special Features: 100 - 5000 RPM
|
Karl Suss RC8 Spinner - Pettit
 | Location: Pettit Cleanroom Substrate Size: < 6 in Number of Substrates Allowed: one 4" wafer Special Features: 100 - 5000 RPM |
SCS G3P8 Spin Coater 1
 | Location: Marcus Inorganic Cleanroom Substrate Size: small pieces to 4" Special Features: 0 - 5000 RPM Multiple small chucks with varying sizes for small pieces |
SCS G3P8 Spin Coater 2
| Location: Pettit Cleanroom Substrate Size: small pieces to 4" Special Features: 0 - 5000 RPM Multiple small chucks with varying sizes for small pieces |
SCS G3P8 Spin Coater 3
| Location: Marcus Inorganic Cleanroom Substrate Size: small pieces to 4" Special Features: 0 - 5000 RPM Multiple small chucks with varying sizes for small pieces |
Laurel Spinner
 | Location: Marcus Inorganic Cleanroom Substrate Size: small pieces - 4" wafer Number of Substrates Allowed: 1 Special Features: PZT and ferrorelectric spin coating; |
Mask Aligners
Mask Aligner Overview
| Equipment Name | Location | Wavelength | Substrate Size | Backside Aligntment | Resolution |
| Karl Suss TSA MA-6 | Marcus | 365nm; 405nm | | | |
| Karl Suss MA-6 - Marcus | Marcus | 365nm; 405nm; 248nm | | | |
| Karl Suss MA-6 - Pettit | Pettit | 365nm; 405nm | | | |
| EVG 620 | Marcus | 365nm | | | |
| OAI | Pettit | 365nm | | |
|
Karl Suss TSA MA6 Mask Aligner
 | Location: Marcus Inorganic Cleanroom Substrate Size: < 6 in Number of Substrates Allowed: 1 Special Features: Top side alignment only |
Karl Suss MA-6 Mask Aligner - Marcus
| Location: Marcus Inorganic Cleanroom Substrate Size: < 6 in Number of Substrates Allowed: 1 Special Features: Topside and backside alignment |
Karl Suss MA-6 Mask Aligner - Pettit
 | Location: Pettit Cleanroom Substrate Size: < 6 in Number of Substrates Allowed: 1 Special Features: Topside and backside alignment |
EVG 620 Mask Aligner
 | Location: Marcus Inorganic Cleanroom Substrate Size: 4" wafer Number of Substrates Allowed: 1 Special Features: 365 nm only |
OAI Mask Aligner
 | Location: Pettit Cleanroom Substrate Size: < 8 in Number of Substrates Allowed: 1 |
Spray Coater
Suss AltaSpray Spray Coater
 | Location: Marcus Inorganic Cleanroom Substrate Size: up to 8 in Photoresist Allowed: AZ4620; NR71-3000p; SC1827 Special Features: Coat resist on sidewalls and corners; Fill trenches up to 2:1 aspect ratio; No soft-bake needed |
Hotplates
Ovens
Image Reversal Oven
 | Location: Marcus Inorganic Cleanroom Substrate Size: up to 8in Temperature: ? Pressure: ? Special Features: Ammonia pattern exposure; Undercut profiles for lift-off |
VWR Oven
 | Location: Marcus Inorganic Cleanroom Substrate Size: Number of Substrates Allowed: ? Special Features: Vacuum oven; |
Thermo Scientific Precision Oven
 | Location: Marcus Inorganic Cleanroom Substrate Size: Temperature: ? Special Features: |
Laser Writer
Microtech Laserwriter LW405
 | Location:Marcus Inorganic Cleanroom Max Work Area: 150mm x 150 mm Position Accuracy: 0.1 um Minimum Line Width: 0.8 um Exposure Wavelength: 405 nm |