IEN - Micro/Nano Fabrication Facility
Processing
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3. Equipment Selection
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Al Etching
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Au Etching
BLE Spinner
Cambridge NanoTech ALD (left) 
Cambridge NanoTech Plasma ALD - Right (non-metal)
Characterization based on Industry Standards
Chemical Dry Etch
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Denton Infinity
Developers Provided
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Suess AltaSpray Coater
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Tystar Poly Furnace 3
Unaxis PECVD
Vision RIE 1
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Wet Etching
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XeF2 Etching
Solder Plating
​
 Equipment
           EquipmentPlating Station

Substrate Sizeup to 6" wafer



 Plating Parametersa

Plating Solution Techni Solder Matte NF820 60/40

Anode Sn/Pb Anode

Anode to Cathode Ratio 1:1

Temperature 20 oC

Stirring Rate 500 rpm

Current Density  30 mA/cm2

Pulse Optional

a: The parameters are provide by Transene

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