IEN - Packaging Research Center
APAMA Automated Flip Chip Bonder
Information
Schedule
Training
Equipment Description

Fully Automated Thermocompresion Bonder with preapplied underfill application.  not available for use by non-prc researchers.

Institute Georgia Tech
Department IEN - Packaging Research Center
Contact Information
Georgia Institute of Technology
Shared User Management System
791 Atlantic Drive
Atlanta GA 30332-0269 
© Georgia Institute of Technology