IEN - Packaging Research Center
Bond Tester

The Xyztec Condor Sigma Bond tester for testing die adhesion, wirebonds, etc with shearing, pulling and tweezer pull capabilities up to 200kg on die shear.

Information
Schedule
Training
Equipment Description

The Xyztec Condor Sigma Bond tester for testing die adhesion, wirebonds, etc with shearing, pulling and tweezer pull capabilities with up to 200kg on die shear.

Institute Georgia Tech
Department IEN - Packaging Research Center
Contact Information
Georgia Institute of Technology
Shared User Management System
791 Atlantic Drive
Atlanta GA 30332-0269 
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