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Equipment Capabilities
Assembly
APAMA Automated Flip Chip Bonder
BGA Rework Station
Bond Tester
Desktop Solder Reflow Oven 1
Desktop Solder Reflow Oven 2
Dicing Saw - Disco
Die Ejector
Die Shear Tester
K&S 4522 Ball Bonder
K&S 4523A Wedge Wire Bonder
Laminar Flow Hood - Dicing Prep
Manual Flip Chip Bonder
Manual Screen Printer - 419
Pettit Lab 160
Quick Circuit 7000 PCB Milling Machine
Semiautomatic Screen Printer
Solder Reflow Oven
Wafer Scoring Tool - Manual
Environmental Testing
Inspection
Substrate Fabrication
Assembly
Contact Information
prclabs@prc.gatech.edu
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