IEN - Packaging Research Center
Die Shear Tester 

The Dage Shear Tester is used primarily to test flip chip bonds by shearing off the bonded die. This can be a destructive or non-destructive test.

Information
Schedule
Training
Equipment Description

The Dage Shear Tester is used primarily to test flip chip bonds by shearing off the bonded die with up to 100kg of force. This can be a destructive or non-destructive test.

Institute Georgia Tech
Department IEN - Packaging Research Center
Contact Information
Georgia Institute of Technology
Shared User Management System
791 Atlantic Drive
Atlanta GA 30332-0269 
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