The Electroless Plating Line provides chemical desmear process and electroless copper plating of 300mm panels. This tool is only available to Packaging Research Center researchers at this time. When scheduling, note the number and size of boards, which process is being run (1-22 full line, 1-6 desmear, or 5-22 eless), and material (glass, si, fr4, etc)

Please fill this form to request desmear or electroless plating.

https://sums.gatech.edu/articles/Desmear