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Assembly
Environmental Testing
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Substrate Fabrication
Automatic Surface Planer
Centrifuge
Convection Oven - 419
Convection Oven DX400
Copper Etching System
Copper Etching System - Differential
Desmear Plating Process
Electroless Copper Plating Line
Electrolytic Plating Line Tank 10
Electrolytic Plating Line Tank 7
Laser Via Drilling System
Mask Aligner and Exposure System
N2 Vacuum Oven - CR
N2 Vacuum Oven - Materials
Nitrogen Oven - Cleanroom
Nitrogen Oven 419 Lab
Ozone Generation System
Photoresist Developer
Planarization System
Plasma Cleaning System
Plating Bath Analyser
Projection Lithography System
Roll Jar Mill
Roll Laminator
Single Level Hot Press
Small Scale Plating - Surface Finish
Spin Coater in Hood
Convection Oven - 419
Information
Schedule
Training
Equipment Description
Convection oven. Substrate size upto 12". Heats upto 250 C. Does not have nitrogen connection.
Institute
Georgia Tech
Department
IEN - Packaging Research Center
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