IEN - Micro/Nano Fabrication Facility
Materials > Etch Tools

 These charts (Thin Film Etching | Laser Etching ) are for quick reference. For the latest up to date information, use the search in the top menu bar to look for equipment which deposit/etch the material.

 Etching

 
ICP		    
Allowed Masks		   SiO2   Shallow
Si		   Deep
Si		   III-V   GaN   Si3N4   Al   Cr   Polymer
Oxford ICP-PECVD                                        
Plasma Therm ICP                       x   x            
STS AOE ICP     Si, PR, Cr, Ti & Ni   x       x           x            
STS HRM ICP   PR, Si3N4, SiO2   x       x                        
STS ICP                                        
STS Pegasus ICP   PR, Si3N4, SiO2           x                        
STS SOE ICP    PR, SiO2, Si3N4, III-V   x   x       x   x                
 
RIE		   Allowed Masks   SiO2   Shallow
Si		   Deep
Si		   III-V   GaN   Si3N4   Al   Cr   Polymer
Advance Vacuum Vision RIE 1   Metal, PR   x   x               x           x
Advance Vacuum Vision RIE 2   Metal, PR   x   x               x           x
Oxford End-point RIE   Metal, PR   x                   x           x
Plasma Therm RIE (Right chamber)   Metal, PR   x   x               x           x
Plasma Therm RIE (Left chamber)   Metal, PR       x       x       x   x   x    
Plasma Therm SLR RIE (Right chamber)   only PR, Si3N4, SiO2           x                        
Plasma Therm SLR RIE (Left chamber)    Metal, PR   x           x       x   x   x    
Technics Micro RIE   (Descum)       x                           x
Unaxis RIE   PR, Si3N4, SiO2       x                           x
 
OTHER		   Allowed Masks   SiO2   Shallow
Si		   Deep
Si		   III-V   GaN   Si3N4   Al   Cr   Polymer
Hydrofluric (HF) Vapor Etcher   PR, Si3N4, SiO2   x                                
Y.E.S.-R1 Plasma Cleaner    (Descum)       x                           x
Gasonics Asher (Pettit | Marcus Inorganic)   (Descum)                                   x
Xactix Xenon Difluroide Etcher   (also etches germanium and molybdenum)       x                            

Laser Etching

 
Laser		   Laser info   Resolution   Polymers   Wood   Paper   Plastics   Metals
Hermes LS500XL CO2   CO2 laser @60W, approx 1mm wavelength   200um spot and sub mm movement   x   x   x   x   Angstrom depth
Resonetics IR   Nd-YLF laser @16W, 1047nm wavelength, 20us pulse/ms   50um spot and sub um movement                   up to 200 microns


 

Contact Information
Hang Chen, Ph.D.
Process Support Manager
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332 | 1152
404.894.3360 | hang.chen@ien.gatech.edu
Georgia Institute of Technology
Shared User Management System
791 Atlantic Drive
Atlanta GA 30332-0269 
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