IEN - Micro/Nano Fabrication Facility
Lithography Mask Aligner Comparisons

UV Mask aligner comparisons

  Tool Location Wavelength (nm) Chuch Size- (dia. wafer inch) Mask holder Size (inch) Backside Alignment  
  Karl Suss MA-6 Marcus 405, 365 [275 on request] 4,6 5,7 Yes  
  Karl Suss MA-6 TSA Marcus 365 4,6 5,7 No  
  EVG620 Marcus 405, 365 4,6 5,7 Yes  
  Karl Suss MA-6 Pettit 405, 365 4,6 5,7 Yes  
  OAI Pettit 405, 365 4,6 5,7 No  
 

*Note to do backside alignement you need to be able to check out the backside aligment chuck for the Karl Suss tools (link)

** Small Pieces can be processed by using either a carrier wafer or bluetape


Other methods to expose the resist include:
  • Electron beam lithography: a beam of electrons directly writes in resist to create very small structures and it was developed for manufacturing integrated circuits, and is also used for creating nanotechnology architectures.
  • Nano-imprint lithography: fabricates nanometer scale patterns at low cost, high throughput and high resolution by creating patterns through mechanical deformation of imprint resist and subsequent processes.
  • Nanoscribe:the next generation 3D laser lithography system.
  • MICROTECH LaserWriter system: a laser beam is controlled as a writing tool for photolithographic mask fabrication or for direct in situ processing on planar substrates (maximum resolutions down to 0.7 µm)
  Tool Location Wavelength (nm) Work area Position Accuracy Minimum Line Width  
  MICROTECH LaserWriter system Marcus 405 150 mm x 150 mm 0.1 micron 0.8 micron  
  Nano-imprint lithography Marcus          
  Nanoscribe Marcus Organic          
  Electron beam lithography Pettit          
Contact Information
Hang Chen, Ph.D.
Process Support Manager
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332 | 1152
404.894.3360 | hang.chen@ien.gatech.edu