Facilities Capabilities

Major Fabrication Tools

All of the more than 200 individual tools (all with 100 mm substrate capability, and some that accommodate larger) within the IEN toolset are accessible to both internal and external users for hands-on use. Training requests, scheduling, and routine communications are all handled through a web-based interface, and in-the- lab access is controlled with an in-house developed electronic access control system which documents all usage for subsequent billing and statistical analysis.

The major tool categories are:

  • Lithography/Patterning: UV Photolithography (365nm, 405nm, 248nm), Nano-imprint, E-beam Lithography, Inkjet Printing, Soft Lithography
  • Dry Etching: Silicon/Polysilicon DRIE (Bosch process), Silicon/Polysilicon DRIE (cryogenic process), Silicon/Polysilicon RIE, Silicon Dioxide (quartz, fused silica) DRIE, Silicon Nitride DRIE (CxFy), III-V Semiconductor DRIE (Cl 2 , BCl 3 , SiCl 4 ), RIE (CH 4 , H 2 ); DRIE (HBr); Metal RIE (Cl 2 , BCl 3 )
  • Wet Etching: Semiconductors, Dielectrics, Metals, Organic Materials
  • High Temperature Processes: Oxidation (wet & dry), Annealing, Polymer Curing, Diffusion Doping (solid-source), Drive-in, Sintering, Rapid Thermal Processing
  • Thin Film Deposition: RF/DC Sputtering, Co-sputtering, Evaporation, ALD, PECVD, APCVD, LPCVD
  • Polymer Deposition: Spin Coating, Spray Coating, CVD (Parylene)
  • Plating: Electroplating (Cu, Ni, Au, Pt, PbSn), Electroless Plating (Ni, Au)
  • Packaging: Wire bonding, Wafer bonding, Anodic bonding, Thermal compression bonding, Eutectic bonding, Flip-Chip bonding, Chemical Mechanical Polishing, Lapping, Lamination
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