IEN - Micro/Nano Fabrication Facility
Processing (Older)
Wire Bonding

Wire Bonding

Wire bonding is an interconnect technology where the chip's active side is facing up and a wire connects the electrodes on the chip to the substrate's electrodes. It is a current standard interconnect in industry. Often for testing, an IC ceramic socket is used to make signals from the chip to the test setup easier. A die attach material is need to keep the chip in place as well as thick enough electrodes to absorb the energy during a bond. It is recommended to have at least a xxx nm Au layer on top of the electrode for wire-bonding purposes. Also after wire-bonding, a protective paryalene coating can be used.


 

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Contact Information
Hang Chen, Ph.D.
Process Support Manager
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332 | 1152
404.894.3360 | hang.chen@ien.gatech.edu